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New Table‑Top Two‑Component AB Glue Dispensing Machine Released for Precision Industrial Adhesive Applications

New Table‑Top Two‑Component AB Glue Dispensing Machine Released for Precision Industrial Adhesive Applications

2026-09-07

HSTECH Launches HS‑D5331 Two‑Component Epoxy and Coating Dispensing Machine

SHENZHEN, China — HSTECH has launched the HS‑D5331, a table‑top two‑component epoxy and coating dispensing machine, also known as an AB glue dispenser, designed to replace inconsistent manual dispensing operations for electronics and general manufacturing industries.

This single‑head dual‑platform dispensing system adopts X/Y1/Y2/Z multi‑axis structure driven by stepping motors and timing belts. It achieves high repeat positioning accuracy of ±0.01 mm, with maximum moving speed up to 300 mm/s. Dispensing precision reaches ±1 % for glue volume and ±1 % for AB mixing ratio, which effectively eliminates defects caused by manual glue mixing and dispensing.

The machine is equipped with separate tanks for A glue and B glue. Users can set custom mixing ratios according to adhesive requirements. Program creation is completed via teach pendant; up to 100 groups of programs can be stored on CF card, and each program supports up to 4000 motion points. It supports versatile dispensing patterns including dots, lines, circles, arcs, continuous paths and 3‑D linear interpolation for complex workpiece surfaces such as vertical planes, gaps and spherical surfaces.

Weighing 45 kg with dimension 630*620*610 mm, the HS‑D5331 works under AC 110‑220V wide‑range power supply. The system features trapezoidal acceleration‑deceleration control and high‑speed low‑noise Japanese stepping motors for stable long‑hour running. Optional upgrades include custom fixtures, glue guns and heating temperature control modules to match diverse production needs.

Widely applied for sensors, relays, power adapters, PCB bonding, COB & IC packaging, speaker components, mobile‑phone battery sealing, hardware encapsulation and automotive mechanical part coating, this automatic dispensing equipment helps manufacturers boost throughput and cut production costs compared with traditional manual workflows.

“Many factories still struggle with uneven glue output and unstable mixing ratios from manual AB glue handling," commented our product specialist. “HS‑D5331 delivers repeatable dispensing quality while keeping operation intuitive for shop‑floor operators."

Prospective clients may contact our sales team to obtain datasheets, technical parameters and quotation for the HS‑D5331 two‑component dispensing solution.

Σφραγίδα
Λεπτομέρειες για το blog
Created with Pixso. Σπίτι Created with Pixso. Ιστολόγιο Created with Pixso.

New Table‑Top Two‑Component AB Glue Dispensing Machine Released for Precision Industrial Adhesive Applications

New Table‑Top Two‑Component AB Glue Dispensing Machine Released for Precision Industrial Adhesive Applications

2026-09-07

HSTECH Launches HS‑D5331 Two‑Component Epoxy and Coating Dispensing Machine

SHENZHEN, China — HSTECH has launched the HS‑D5331, a table‑top two‑component epoxy and coating dispensing machine, also known as an AB glue dispenser, designed to replace inconsistent manual dispensing operations for electronics and general manufacturing industries.

This single‑head dual‑platform dispensing system adopts X/Y1/Y2/Z multi‑axis structure driven by stepping motors and timing belts. It achieves high repeat positioning accuracy of ±0.01 mm, with maximum moving speed up to 300 mm/s. Dispensing precision reaches ±1 % for glue volume and ±1 % for AB mixing ratio, which effectively eliminates defects caused by manual glue mixing and dispensing.

The machine is equipped with separate tanks for A glue and B glue. Users can set custom mixing ratios according to adhesive requirements. Program creation is completed via teach pendant; up to 100 groups of programs can be stored on CF card, and each program supports up to 4000 motion points. It supports versatile dispensing patterns including dots, lines, circles, arcs, continuous paths and 3‑D linear interpolation for complex workpiece surfaces such as vertical planes, gaps and spherical surfaces.

Weighing 45 kg with dimension 630*620*610 mm, the HS‑D5331 works under AC 110‑220V wide‑range power supply. The system features trapezoidal acceleration‑deceleration control and high‑speed low‑noise Japanese stepping motors for stable long‑hour running. Optional upgrades include custom fixtures, glue guns and heating temperature control modules to match diverse production needs.

Widely applied for sensors, relays, power adapters, PCB bonding, COB & IC packaging, speaker components, mobile‑phone battery sealing, hardware encapsulation and automotive mechanical part coating, this automatic dispensing equipment helps manufacturers boost throughput and cut production costs compared with traditional manual workflows.

“Many factories still struggle with uneven glue output and unstable mixing ratios from manual AB glue handling," commented our product specialist. “HS‑D5331 delivers repeatable dispensing quality while keeping operation intuitive for shop‑floor operators."

Prospective clients may contact our sales team to obtain datasheets, technical parameters and quotation for the HS‑D5331 two‑component dispensing solution.