News Article: HS‑D5331 Two‑Component Epoxy & Coating Dispensing Machine Launched for High‑precision AB Glue Automation Production
Shenzhen, China — HSTECH (Shenzhen Hansome Technology Co.,Ltd.) has officially launched the HS‑D5331 table‑top two‑component epoxy & coating dispensing machine, also known as AB glue dispensing machine. This single‑head dual‑station automated equipment addresses industry pain points of uneven manual dispensing, delivering stable, repeatable two‑part adhesive processing for electronics, automotive, handicraft and household appliance manufacturing.
Note: Product photos are for reference only. Please refer to the real machine.
Industry Trend & Product Significance
Global manufacturing is shifting toward miniaturized electronic assemblies and electric‑vehicle‑driven lightweight production, raising stricter requirements for two‑component epoxy sealing, potting and coating. Manual mixing and dispensing can hardly meet modern quality standards: inconsistent mixing ratios cause product failure, while manual operation brings high material waste and unstable throughput.
Market trends show three key directions:
- Higher precision demand: Manufacturers pursue tight tolerance on glue volume and mixing ratio to boost product reliability for sensors, PCBA and automotive parts.
- Flexible small‑to‑medium batch production: Factories need programmable bench‑top equipment instead of only large inline production lines for frequent product change‑over.
- Cost‑effective automation: Enterprises replace manual work to cut rework rate, lower labor cost and reduce adhesive waste.
Against this background, the HS‑D5331 fills an important market position. Its ±1% dispensing & ratio accuracy, 3D multi‑track programming and dual‑platform design help mid‑size manufacturers realize automated AB glue processing without heavy investment on huge production lines. It acts as a cost‑efficient entry‑level automation tool bridging manual operation and full‑scale inline dispensing systems.
Core Product Specifications
| Item |
Parameter |
| Dispensing Speed |
10‑150g/5s (based on 1:1 glue proportion) |
| Dispensing Precision |
Glue Amount ±1%, Glue Proportion ±1% |
| Repeatability |
±0.01 mm |
| X/Y1/Y2/Z Working Range |
500300300*100 mm |
| Max XYZ Moving Speed |
300 mm/s |
| Drive System |
Stepping Motor + Timing Belt |
| Dispensing Patterns |
Lines, Circles, Arcs, Continuous Paths, 3D Linear Interpolation |
| Programming Mode |
Teach Pendant |
| Program Storage |
≥100 groups, max 4000 points per group (CF card storage) |
| I/O & Communication |
8 Input / 8 Output, RS232 port |
| Working Environment |
10‑40℃, 20‑90%RH (no condensation) |
| Power Supply |
AC110‑220V, 50/60Hz, 300W |
| Machine Dimension |
630620610 mm |
| Net Weight |
45 kg |
Key Application Fields
HS‑D5331 is widely used for: Sensors, relays, power adapters, electronic toys, sounders, home appliances, coils, speakers, mobile phone batteries, PCB bonding, COB, IC, PDA, LCD sealing, hardware encapsulation, quantitative liquid filling, chip bonding, automotive mechanical parts coating, mechanical seals and other processes.
Compared with traditional manual dispensing, this automatic equipment eliminates inconsistent glue application, improves production efficiency and cuts comprehensive manufacturing costs, becoming a preferred automation solution for many manufacturers.
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